The long-anticipated move to 2.5D and fan-outs is raising some familiar questions about security. Will multiple chips combined in an advanced package be as secure as SoCs where everything is ...
OSATs and ATE vendors are making progress in determining what works and what doesn’t in 2.5D packaging, expanding their knowledge base as this evolves into a mainstream technology. Most experts ...
Complete high-performance 2.5D package solution enables heterogeneous integration SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the tapeout of ...
SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it will provide turnkey semiconductor solutions using the ...
Chip employs TSMC CoWoS ® technology to integrate SoC and HBM2 SAN JOSE, Calif., May 01, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, custom IP, and advanced 2.5D ...
We're hearing the news from TheElec's sources, who said Samsung has ordered 16 units of the equipment from the packaging firm, with the South Korean giant receiving 7 of the units already, and will ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the tapeout of Cadence ® 16G UCIe™ 2.5D advanced package IP on TSMC’s 3nm (N3E) process technology.
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