Artificial intelligence is colliding with a hard physical limit: the energy it takes to move data on and off chips. Training ...

D stacking doubles the operating temperature inside the GPU, rendering it inoperable. But the team, led by Imec’s James Myers ...

At Intel's big Innovation 2023 event, CEO Pat Gelsinger confirmed that the company would adopt a 3D Cache approach for CPUs in the future - though it won't be a part of the upcoming Meteor Lake ...

Bernin (France), June 3, 2025 – Soitec (Euronext – Tech Leaders), a world leader in the design and production of innovative semiconductor materials, today announced a strategic collaboration with ...

After memory products like NAND Flash and DRAM, it's reported that Samsung Electronics will conduct R&D for a "3D stacking" technology that can vertically stack system semiconductor transistors.

TL;DR: Huawei is set to lead Apple by integrating high-performance HBM DRAM with 3D stacking technology in smartphones, boosting AI efficiency and bandwidth while reducing chip size. Apple plans to ...

TSMC has recently announced SoIC-P, microbump versions of its System on Integrated Chips (SoIC) solutions providing a cost-effective way for 3D chip stacking. TSMC said SoIC-P complements its existing ...

By using advanced "3D stacking" technology, Izmo re-engineered a standard 200mm x 200mm electronics board into a compact 81mm ...

Hybrid, 3D integrated optical transceiver. (A,B) The test setup: the photonic chip (PIC) is placed on a circuit board (green), and the electronic chip (EIC) is bonded on top of the photonic chip. (C) ...

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...