New York – Micron Technology Inc. tripled the volume of wafer starts with 6F2 designs in the last three months, setting the DRAM manufacturer on track to reclaim its title as the industry's most ...

To push access times toward those of SRAM while achieving much higher densities, embedded DRAM needs a structure that differs from both commodity DRAM and conventional embedded DRAM. The challenge is ...

Flash memory has made incredible capacity strides thanks to monolithic 3D processing enabled by the stacking of more than 200 layers, which is on its way to 1.000 layers in future generations.[1] But ...