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MIT's chip stacking breakthrough could cut energy use in power-hungry AI processes
Data doesn’t have to travel as far or waste as much energy when the memory and logic components are closer together.
For decades, chipmakers have squeezed more computing power out of silicon by shrinking transistors, but that strategy is running into hard physical limits. A new approach from MIT aims to sidestep ...
Researchers at MIT have developed a fabrication approach that stacks multiple active components on the back end of a ...
The 2D devices fabricated using CDimension’s ultra-thin films have demonstrated up to a 1,000X improvement in ...
GlobalData on MSN
SST and UMC clear 28nm automotive memory for mass production
The platform integrates the embedded SuperFlash Gen 4 (ESF4) memory from US-based Microchip Technology’s subsidiary with ...
Interesting Engineering on MSN
China’s hair-thin fiber chips bring computer-level processing into washable fabric
Chinese scientists have developed fully flexible fiber chips that embed complete electronic circuits inside ...
The relentless shrinking of silicon components has led to exponential improvements in chip performance, but we’re starting to hit physical limits. Now researchers have developed a way to integrate ...
Applied Materials Unveils Next-Gen Chipmaking Systems, Aims To Boost AI Logic And Memory Performance
Applied Materials (NASDAQ:AMAT) unveiled a suite of advanced semiconductor manufacturing systems to enhance the performance and efficiency of logic and memory chips that power artificial intelligence ...
Dresden-based startup FMC raises another 100 million euros, expands its management team, and plans its own chip factory in ...
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