D stacking doubles the operating temperature inside the GPU, rendering it inoperable. But the team, led by Imec’s James Myers ...

Artificial intelligence is colliding with a hard physical limit: the energy it takes to move data on and off chips. Training ...

A new inter-die gapfill tool is purpose-built to solve critical challenges in 3D stacking and high-density heterogeneous integration. VECTOR TEOS 3D provides ultra-thick, uniform inter-die gapfill by ...

YOKOHAMA, Japan, Aug. 27, 2025 /PRNewswire/ -- Socionext, the Solution SoC company, today announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of ...

Advancing AI Chip Manufacturing With Applied Materials Today Building the chips that power artificial intelligence is getting ...

A new digital system allows operations on a chip to run in parallel, so an AI program can arrive at the best possible answer ...

Today’s stunning computing power is allowing us to move from human intelligence toward artificial intelligence. And as our machines gain more power, they’re becoming not just tools but decision-makers ...

BEIJING, Dec 9 (Reuters) - U.S. President Donald Trump said the United States would allow Nvidia's H200 processors to be exported to China, though it remains unclear whether Beijing will give the ...

Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...

Detailed price information for Lam Research Corp (LRCX-Q) from The Globe and Mail including charting and trades.

A new chip-based quantum memory uses nanoprinted “light cages” to trap light inside atomic vapor, enabling fast, reliable ...