Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...

Peek inside the package of AMD’s or Nvidia’s most advanced AI products and you’ll find a familiar arrangement: The GPU is flanked on two sides by high-bandwidth memory (HBM), the most advanced memory ...

Artificial intelligence is colliding with a hard physical limit: the energy it takes to move data on and off chips. Training ...

Key opportunities include the growth of high-performance computing, automotive electronics, and IoT applications 3D ...

Agentic AI is driving a major transformation in computing, enabled by more powerful processors and new semiconductor manufacturing techniques. Traditional single-chip architectures are reticle-limited ...

Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...

Today’s stunning computing power is allowing us to move from human intelligence toward artificial intelligence. And as our machines gain more power, they’re becoming not just tools but decision-makers ...

BEIJING, Dec 9 (Reuters) - U.S. President Donald Trump said the United States would allow Nvidia's H200 processors to be exported to China, though it remains unclear whether Beijing will give the ...

A stacked chip captures, encrypts, and searches image data directly on hardware, combining photodetection, memory, and key generation for secure real-time processing in connected devices. (Nanowerk ...

A new digital system allows operations on a chip to run in parallel, so an AI program can arrive at the best possible answer ...

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

Taiwan has launched CoCoB, a substrate-less chip packaging platform targeting academic institutions and startups locked out ...