CARROLLTON, Tex. — A spin-off of Amkor Technology Inc. in Texas is quietly developing and producing a new class of substrates that could accelerate the development of true system-in-packaging (SIP) ...

LG Innotek recently unveiled the latest FC-BGA for the first time at the 'CES 2023'. LG Innotek's FC-BGA is highly integrated, multi layered and large scaled. Also, it has fine patterning and a lot of ...

Korea's two major printed circuit board (PCB) makers are expected to showcase their latest products at an industry exhibition in Incheon this week. LG Innotek and Samsung Electro-Mechanics said their ...

Samsung Electro-Mechanics and LG Innotek are focusing on the high-value semiconductor substrate "flip chip ball grid array" (FC-BGA) to diversify their business portfolios. But as Taiwan's TSMC, the ...

Gigavis is showing strong performance. It appears that the analysis predicting the establishment of a dominant position in glass substrates, such as flip-chip ball grid array (FC-BGA), is influencing ...

SEOUL, South Korea, April 30, 2025 /PRNewswire/ -- LG unveiled the Dream Factory, a hub for the production of FC-BGAs (Flip Chip Ball Grid Arrays), the company's next-generation growth engine, to the ...

New York, United States, Jan. 10, 2024 (GLOBE NEWSWIRE) -- With the proliferation of new IC types such as BGA (ball grid array) and CSP (chip scale package), which require different package carriers, ...