Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...

Potential sources of RF coupling. How to cut some of the coupling sources. Best practice design to create a system that’s immune to coupling. Wireless system-on ...

As the technology node decreases, meeting inter-wire or coupling capacitance becomes extremely critical and challenging in SOC design. Shrinking technology node leads to increase in dielectric values, ...

Designing with high-fidelity capacitive proximity sensors requires careful consideration of mechanical design, sensor placement/design, and end-application operating environments. Careful evaluation ...