Achieving high reliability and low cost package substrate compared with silicon interposer package Tokyo, December 11, 2015 --- Hitachi, Ltd. (TSE: 6501) and Hitachi Metals, Ltd. (TSE: 5486) have ...
DUBLIN, Feb. 20, 2024 /PRNewswire/ -- The "Ceramic Substrates Market by Product Type (Alumina, Aluminum Nitride, Silicon Nitride, Beryllium Oxide), End-use Industry (Consumer Electronics, Automotive, ...
TOKYO — Sanyo Electric Co. Ltd. has moved one step ahead in system-in-package technology with its Integrated System in Board (ISB) packaging approach. Sanyo's solution takes multiple ICs, transistors ...
Global Ceramic Substrates Market to Reach $10 Billion by 2027. Amid the COVID-19 crisis, the global market for Ceramic Substrates estimated at US$6. 6 Billion in the year 2020, is projected to reach a ...
MUNICH, Germany — The Japanese Kyocera Corporation has developed a multilayer ceramic substrate for use in Electronic Control Units (ECU) in automatic automotive transmissions. The material ...
System-in-package (SiP) is quickly emerging as the package option of choice for a growing number of applications and markets, setting off a frenzy of activity around new materials, methodologies, and ...
Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback