Compression molded “smoke pan” designed for conversion from 2-D to 3-D form. Hat angle and plateau optimized to prevent part from shrinking against mold surfaces. Angle changes optimized with radii to ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

As automotive engineers continue to search for ways to make lighter, less-costly components, the compression molding of composites has taken center stage in composites-for-metal substitution. Unlike ...