Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

For the PDF version of this feature, click here. In most modern power semiconductor applications there is a need to carefully manage heat. This is true in fields as diverse as mobile communications, ...

December 12, 2011. Mentor Graphics Corp. has announced what it calls the electronic industry’s first combined technology for thermal characterization and simulation with T3Ster® hardware test products ...

The trend in end-equipment design is to optimize the module profile for sizing. This introduces a migration from metal heat sinks to PCB copper plane-based thermal management. Today’s modules use ...