Like any successful system-on-chip (SoC) effort, a multi-die system-in-package (SiP) project must start with a sound system design. But then what? Are the steps in the SiP design flow different from ...

Synopsys, Inc. SNPS is advancing its role in semiconductor design by expanding its collaboration with Taiwan Semiconductor Manufacturing Company TSM, also known as TSMC. The partnership focuses on ...

If you are exploring a multi-die project and need guidelines on getting started, this white paper is for you. Any engineer on a semiconductor design project has read many articles about the power, ...

The first question design teams need to consider is what functional blocks and functions will be included in a design and how those functions will be partitioned into different chiplets. Additionally, ...