TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has begun development of a photomask manufacturing for 2-nanometer (10-9 meter) generation logic semiconductors that support ...
TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP) (TOKYO: 7912) has successfully developed a photomask manufacturing process capable of accommodating the 3-nanometer (10-9 meter) lithography ...
DELRAY BEACH, Fla., Feb. 3, 2026 /PRNewswire/ -- According to MarketsandMarkets™, the Extreme Ultraviolet (EUV) Lithography ...
ASML provided Intel, its first customer, with the $380 million Twinscan EXE:5000 High-NA lithography machine. Yesterday, it shipped its second High-NA EUV lithography machine to a mystery customer.
New VeritySEM ® 10 system delivers industry-leading resolution and imaging speed to help chipmakers accelerate process development and maximize yield in high-volume manufacturing SANTA CLARA, Calif., ...
TSMC has said that its new chip manufacturing technology -- A16 -- will enter production in the second half of 2026, where it will be in a semiconductor battle with Intel for the world's fastest chips ...
TSMC reiterated its long-known stance on next-generation High-NA EUV lithography tools at its European Technology Symposium in Amsterdam. The company does not require these highest-end lithography ...
ASML is the only company in the world that makes extreme ultraviolet lithography machines, which are crucial for ...
Imec has achieved the first successful wafer-scale fabrication of solid-state nanopores using EUV lithography on 300mm wafers. This innovation transforms nanopore technology from a lab-scale concept ...
Samsung announced yesterday that its new 7nm node with EUV (Extreme Ultraviolet Lithography) is ready to begin risk production, just a week after TSMC made the same announcement. Despite the close ...
To continue pursuing Moore's law, chipmakers will require EUV lithography tools. EUV uses lower-wavelength light (13.5-nm versus 193-nm for current immersion tools) and simplifies the process flow (3 ...