Bolstering high-end substrate production capabilities to meet semiconductor needs for AI and data centers December 17, 2025-- TOPPAN Inc. (TOPPAN), a TOPPAN Group company and wholly owned subsidiary ...
Samsung Electro-Mechanics (SEMCO) reportedly plans to install a new production line for ABF-based flip chip ball grid array (FCBGA) substrates at its factory site in Vietnam, with investment estimated ...
TOKYO--(BUSINESS WIRE)-- Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...
LG Innotek has entered the glass substrate business, which is regarded as a "game changer" in next-generation semiconductor ...
Samsung Electro-Mechanics announced plans to expand the proportion of high-value-added flip chip ball grid array (FCBGA) products, including servers, artificial intelligence (AI), automotive ...
(RTTNews) - TOPPAN, a subsidiary of TOPPAN Holdings Inc. (TPX.F), and Tekscend Photomask Corp. will join at SEMICON Japan 2025, showcasing semiconductor photomasks, advanced semiconductor packaging ...
Taiwan-based ASE Technology and Unimicron Technology have both seized flip chip ball grid array (FC-BGA) packaging and related substrate orders for Apple's just unveiled M2 processors, along with ...
AUSTIN, Texas — LSI Logic Corp. said it is production-ready with flip-chip packages on an 0.11-micron process that includes low-k dielectrics. The soft, porous nature of low-k materials presents a ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback