Revenues generated at Unimicron Technology's new flip-chip ball-grid array (FC BGA) substrate plant will reach NT$500 million (US$15.3 million) per month in 2016, up from about NT$350 million in ...

Taiwan-based ASE Technology and Unimicron Technology have both seized flip chip ball grid array (FC-BGA) packaging and related substrate orders for Apple's just unveiled M2 processors, along with ...

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...

Samsung Electro-Mechanics announced plans to expand the proportion of high-value-added flip chip ball grid array (FCBGA) products, including servers, artificial intelligence (AI), automotive ...

SAN MATEO, Calif. — Fujitsu Ltd. and two subsidiaries, Fujitsu Tohoku Electronics Ltd. and Fujitsu Microelectronics Inc. (FMI), will expand production of wafer bumping and flip-chip ball-grid-array ...

SEOUL, South Korea, May 12, 2025 /PRNewswire/ -- LG unveiled the Dream Factory, a hub for the production of FC-BGAs (Flip Chip Ball Grid Arrays), the company's next-generation growth engine, to the ...

(RTTNews) - TOPPAN, a subsidiary of TOPPAN Holdings Inc. (TPX.F), and Tekscend Photomask Corp. will join at SEMICON Japan 2025, showcasing semiconductor photomasks, advanced semiconductor packaging ...

Lidless FCBGA packages maximize PCB real estate by allowing closer spacing between passive components and the flip chip die. Lidless FCBGA packages enable the die to contact with an external heat sink ...

The Global Electronics Association has published a new international standard, IPC‑6921, for organic IC substrates.

Combined, laminate substrates and leadframes will represent an estimated US$ 13.3 billion market in 2011 and is forecasted to reach $14 billion in 2012. This is larger than the revenues for silicon ...