Data center servers, powerful smartphones, and your computer's motherboard have one thing in common. When these devices get ...

Apple's new M5 Pro and M5 Max MacBook Air laptops will reportedly use TSMC 2.5D advanced packaging will be used for improved heat dissipation, and more.

With Samsung’s upcoming Exynos 2600, which will be its flagship chip for 2026, the company is going to introduce a new heat dissipation technology. This could help bring Qualcomm back to Samsung’s ...

Peking University, September 24, 2025: Professor Song Bai’s team from the College of Engineering at Peking University has reported a breakthrough in microchannel cooling technology, achieving ...

A Chinese research team has broken through a long-standing bottleneck in refrigeration technology by introducing a novel ...

(Nanowerk Spotlight) Lasers power modern life, from fiber optic networks that drive internet communications to precision tools that enable complex surgery. Most commercial lasers emit light at fixed ...

Japanese firm Nuvoton Technology has started mass production of its high-power UV semiconductor laser (379 nm, 1.0 W), which delivers industry-leading optical output in a 9.0 mm diameter CAN package ...

In recent years, the space industry has experienced unprecedented explosive growth, with the number of satellite launches increasing exponentially. By the end of 2023, the number of global operational ...

In the ever-evolving landscape of data center operations, efficiency and sustainability are paramount concerns. As data demands continue to surge with the expanding use of artificial intelligence (AI) ...

Long-term OEM partnerships provide revenue predictability and market protection.

Samsung is introducing a new heat dissipation technology called Heat Pass Block with its upcoming Exynos 2600, which could be the world’s first 2nm mobile chip. The built-in copper heatsink aims to ...