GENIO EVO, an integrated chiplet/package EDA tool from MZ Technologies, addresses thermal and mechanical stress in the pre-layout stage of 3D IC design. Set to be demonstrated at this month’s Chiplet ...

As the semiconductor industry continues its relentless march towards smaller process nodes and more complex integrated circuits (ICs), the challenge of ensuring reliability has become increasingly ...

In the realm of high-performance IC (integrated circuit) design, symmetry is not just an aesthetic preference—it’s a critical factor for ensuring proper device functionality, especially in analog and ...

The relentless pursuit of higher performance and greater functionality has propelled the semiconductor industry through several transformative eras. The most recent shift is from traditional ...

United Microelectronics Corp. (UMC) recently issued a notice to its suppliers demanding a 15% price reduction, signaling heightened cost pressures within the semiconductor supply chain. While some ...

Taiwan's integrated circuit (IC) design sector faces intensified challenges as 2026 begins that may push its global revenue ...