Layout for ICs at process geometries of 90 nm and below becomes a very dicey affair. Even at 180 nm, the number of design rules that must be enforced for an ASIC or system-on-a-chip to be ...

SANTA CRUZ, Calif. — Claiming the first automated design for manufacturability (DFM) capability “designed for designers,” Silicon Canvas announced a new set of DFM features for its Laker custom IC ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

In the realm of high-performance IC (integrated circuit) design, symmetry is not just an aesthetic preference—it’s a critical factor for ensuring proper device functionality, especially in analog and ...

As the complexity of IC designs continues to grow, moving critical checks earlier in the design cycle helps designers identify and resolve issues before they escalate, streamlining the overall ...

2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a ...