A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” was written by researchers from Amkor. Find the technical paper here.
TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology, Inc. (NASDAQ: AMKR), a leading outsourced semiconductor packaging and test service provider, today announced the expansion of its collaboration with ...
Injection-molded packaging can protect in vitro diagnostic kits and reagents. The ELISA packaging kit is molded from high-impact polypropylene resin and designed with living hinges for secure closure ...
The PowerBurst MCI integration kits promise to simplify the packaging and integration of Maxwell Technologies’ MC Power Series Boostcap ultracapacitors. Enlisting Tecate’s patented interlocking ...
For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.
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