EDN

Philips Research claims record-breaking MEMS capacitors

EINDHOVEN, Netherlands ” Philips Research scientists have made MEMS (microelectromechanical systems) capacitors that could be used to enhance the performance and reduce the size of RF circuits in ...
Semiconductor Engineering

WLFO For High-Performance Low-Cost Packaging Of RFMEMS-CMOS

Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of ...
Business Wire

Cavendish Kinetics Announces Breakthrough RF MEMS Technology For Improving Wireless Component, Device and Network Performance

SAN JOSE, Calif.--(BUSINESS WIRE)--Cavendish Kinetics, a leading provider of RF MEMS solutions for dramatically improving connectivity between wireless devices and cell towers, today announced ...
Semiconductor Engineering

Wafer-Level Fan-Out For High-Performance, Low-Cost Packaging Of Monolithic RF MEMS/CMOS

Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of ...
AZOM

Nanusens Solves Challenges of 6G RF Front End Design with its RF DTCs

Nanusens has announced that it has used its pioneering MEMS-within-CMOS™ technology to create a novel solution to the challenge of creating better RF front ends for 6G. Josep Montanyà, Nanusens’ CEO, ...