Identiv, Inc., a provider of RFID and BLE-enabled Internet of Things (IoT) solutions, today announced its portfolio of next-generation, high-frequency (HF) near field communication (NFC)-enabled ...

High-performance specialty inlays deliver enhanced RF performance, faster reading speed, and more impactful NFC user interactions for IoT applications SANTA ANA, Calif.--(BUSINESS WIRE)--Identiv, Inc.

Identiv’s high-frequency NFC-enabled inlays leverage NXP’s ICODE 3 tag IC, boosting RF performance and read speed. Designed for IoT applications, the ICODE 3 chip includes features suited for ...

Several businesses are deploying a dual-frequency label from Avery Dennison Smartrac, featuring both UHF RFID and Near Field Communication (NFC), to enable inventory and supply chain management, ...

Bringing ST's semiconductor device portfolio to Identiv's (INVE) customers, providing greater supply availability and enhanced capabilities for specialty RFID-enabled IoT applications FREMONT, Calif., ...

FREMONT, Calif., July 30, 2018 (GLOBE NEWSWIRE) -- Identiv, Inc. (Nasdaq: INVE) today announced the latest addition to its radio-frequency identification (RFID), near-field communication (NFC), and ...

Industry-leading low carbon footprint, optimised design Ultra-thin and physically flexible for seamless integration – even on curved surfaces iOS/Android and NFC Forum Type-V compatibility UK-based ...

FREMONT, Calif., Jan. 23, 2020 (GLOBE NEWSWIRE) -- Identiv, Inc. (INVE) (NASDAQ: INVE) today announced its commitment to creating a sustainable ecological footprint with the latest release in its ...

Identiv, Inc. has unveiled new high-frequency NFC-enabled inlays powered by NXP’s ICODE 3 chip, enhancing performance for various IoT applications.

FREMONT, Calif., Jan. 23, 2020 (GLOBE NEWSWIRE) -- Identiv, Inc. (NASDAQ: INVE) today announced its commitment to creating a sustainable ecological footprint with the latest release in its transponder ...

Pragmatic NFC Connect product innovation expands market opportunities for edge and item-level intelligence at scale -- Industry-leading low carbon footprint, optimised design -- Ultra-thin and ...