Hosted on MSN

Intel Foundry Roadmap Update - New 18A-PT variant that enables 3D die stacking, 14A process node enablement

Intel's new CEO Lip Bu-Tan took to the stage at the company's Intel Foundry Direct 2025 event here in San Jose, California, to outline the company's progress on its foundry initiative. Tan announced ...

Securities firm research suggests that Intel is on track to garner chip manufacturing and packaging orders from Apple, Broadcom, Google, and maybe even Nvidia

Intel's 14A process node and die-stacking EMIB are the favoured technologies.
EurekAlert!

A valuable and low‑budget process scheme of equivalized 1 nm technology node based on 2D materials

Emerging two-dimensional (2D) semiconductors are among the most promising materials for ultra-scaled transistors due to their intrinsic atomic-level thickness. As the stacking process advances, the ...
NextBigFuture

The next semiconductor node only provides 25% boost so Efficient Chip Stacking is a path forward

The difference between 28 and 20 nm is about 20 to 25 percent accord to Nvidia’s Chief Scientist Dally. Therefore, process doesn’t matter that much anymore. If Nvidia is clever about architecture and ...