LAS VEGAS, NV, UNITED STATES, January 20, 2026 / EINPresswire.com / — CIT (CEO Seung Jeong) announced its participation in ...
DELRAY BEACH, Fla., Oct. 31, 2025 /PRNewswire/ -- The MEMS packaging substrate market is expected to grow from USD 2.40 billion in 2025 to USD 3.23 billion by 2030, at a CAGR of 6.1% according to a ...
SmartSolve has introduced its PureNil 0 packaging substrate, said to be a 100% bio-based and flushable material designed to ...
The Global Electronics Association has published a new international standard, IPC‑6921, for organic IC substrates.
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Which packaging materials are best for the planet?
From paper and cardboard to plastic and plant-based alternatives, packaging materials vary widely in their impact on the environment.
Intel has announced that its first glass substrate for next-generation advanced packaging will enter mass production between 2026 and 2030. Save my User ID and Password Some subscribers prefer to save ...
The MarketWatch News Department was not involved in the creation of this content. Engineered for precise, clamp-free flattening of highly warped glass substrates and seamless integration with existing ...
New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...
Low-cost high-performance flexible substrate materials are now available. Solderable up to 300°C, they come with 1 oz of copper (and other custom thicknesses) on ...
According to projections from Towards Packaging, the global barrier coatings for flexible packaging market is set to increase from USD 6.43 billion in 2026 to nearly USD 12.96 billion by 2034, ...
WENZHOU, ZHEJIANG, CHINA, January 20, 2026 /EINPresswire.com/ -- The global packaging industry is undergoing a period ...
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