The Marvell RDL interposer reduces design cost through its modular design. In conventional chiplets, a single interposer will span the floor space of the chips it connects well as any area between ...
The advanced packaging architecture designed for AI and high-performance computing (HPC) applications involves positioning memory in close proximity to AI processors, such as GPUs and AI ASICs, on a ...
The Marvell multi-die packaging solution allows for shorter die-to-die interconnects and a modular RDL interposer. The Marvell RDL interposer reduces design cost through its modular design. In ...
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