OSAKA, Japan--(BUSINESS WIRE)--Panasonic Corporation today announced that it will launch the industry's smallest enhancement-mode[1] gallium nitride (GaN)[2] power transistors (X-GaN TM)** package.

The Simcenter Micred Quality Tester from Siemens enables the assessment of a semiconductor package's thermal structure to identify manufacturing defects, including die-attach issues. With the ...

Marktech Optoelectronics and manufacturing partner Optrans are introducing new transfer-moulded photodiode and LED packaging ...

A new type of transistor structure, invented by scientists at the University of Illinois at Urbana-Champaign, has broken the 600 gigahertz speed barrier. The goal of a terahertz transistor for ...

the scaling of silicon-based metal-oxide-semiconductor field-effect transistors (Si MOSFETs) and evolution of novel structure transistors in accordance with Moore’s Law, especially for modern ...

Intel has come out swinging in a big way celebrating the 75th anniversary of the transistor, where at IEDM 2022 (the International Electron Devices Meeting) that the company is aiming for 10x density ...

Research groups in Japan and the U.S. jointly developed a double-layered nanowire, consisting of a germanium core and a silicon shell, which is a promising material for high-speed transistor channels.

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

CHAMPAIGN, Ill. — A new type of transistor structure, invented by scientists at the University of Illinois at Urbana-Champaign, has broken the 600 gigahertz speed barrier. The goal of a terahertz ...