Before circuit design can begin on any advanced semiconductor manufacturing process, the electrical behavior of the devices — transistors, diodes, resistors — must be described accurately in so-called ...
AUSTIN, Texas--(BUSINESS WIRE)--The Si2 Compact Model Coalition has released the latest version of BSIM-CMG FinFET, a standard compact SPICE model developed by researchers at the University of ...
SAN FRANCISCO — The Compact Model Council (CMC) has selected the PSP model, jointly developed by Pennsylvania State University and Royal Philips Electronics, as the next generation industry standard ...
YOKOHAMA, Japan--(BUSINESS WIRE)--Semiconductor Energy Laboratory Co., Ltd. (SEL) and Silvaco, Inc. today announced that they have jointly developed a SPICE model of oxide semiconductor FETs (field ...
A SPICE model based on the BSIM3 core eliminates shortcomings in the existing level 1 and level 3 subcircuit models, enabling better simulation of trench-type power MOSFETs. An improved SPICE model ...
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