Amid the competition among SK Hynix and Samsung Electronics regarding HBMs, SK Hynix reportedly plans to team with Amkor to enter the interposer market to alleviate the interposer shortage and fend ...

In vying for Nvidia's next-generation memory orders, SK Hynix is prioritizing cost reduction through a more radical approach: eliminating silicon interposers entirely from HBM4 production, while ...

Lightmatter this week unveiled a pair of silicon photonic interconnects designed to satiate the growing demand for chip-to-chip bandwidth associated with ever-denser AI deployments.… The first of ...

Leti has used an active interposer as a modular and energy-efficient integration platform that can integrate large-scale chiplet-based computing systems such as HPC and big-data applications – the ...

Fiber-optic cables are creeping closer to processors in high-performance computers, replacing copper connections with glass.

Interposers and bridges, two of the key elements for interconnecting multiple chips and chiplets in an advanced package, are undergoing fundamental changes in how they’re built and assembled.

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the immediate availability of its next-generation 2.5D ...

NVIDIA still hasn't signed on with Samsung for its HBM memory chips, something that will need to be resolved by NVIDIA because it requires Samsung's silicon interposers and advanced chip packaging. In ...

Once the hotbed of chip development and manufacturing, Japan has been surpassed by the likes of Taiwan, South Korea, and the US. In a move to bring it back to the forefront of semiconductors, a new ...

BOSTON and DAEJEON, South Korea, Sept. 16, 2025 /PRNewswire/ -- OPROCESSOR INC, incorporated in Boston, Massachusetts in 2018 with research operations in Daejeon, South Korea, today announced a ...

POET Technologies' stock surged 80% in five days, driven by its innovative Optical Interposer technology, which integrates photonic and electrical components for faster, efficient data transfer.