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2:44
YouTube
Global Update
IBM’s 3D Chip Stacking Process Could Revive a Famous Rule on Computing Power
IBM Research and Tokyo Electron (TEL) collaborated on a new breakthrough in 3D chipmaking that uses a novel method to keep Moore's Law in motion. The two companies partnered on a chipmaking innovation that simplifies the process for producing wafers with 3D chip stacking technology. #IBM #Chip #Technology
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Jul 13, 2022
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